Findchips: Compare 74AUP1G386GW,125 vs 74LVC1G02GM

74AUP1G386GW,125 vs 74LVC1G02GM feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	NXP SEMICONDUCTORS	PHILIPS SEMICONDUCTORS
Part Package Code	TSSOP
Package Description	PLASTIC, SC-88, SOT-363, SMT-6
Pin Count	6
Manufacturer Package Code	SOT363
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	4 Weeks
Family	AUP/ULP/V
JESD-30 Code	R-PDSO-G6	R-PDSO-N6
JESD-609 Code	e3
Length	2 mm
Load Capacitance (CL)	30 pF
Logic IC Type	XOR GATE	NOR GATE
Max I(ol)	0.0017 A
Moisture Sensitivity Level	1
Number of Functions	1
Number of Inputs	3
Number of Terminals	6	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	SON
Package Equivalence Code	TSSOP6,.08	SOLCC6,.04,20
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	22.1 ns
Propagation Delay (tpd)	22.1 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	NO
Seated Height-Max	1.1 mm
Supply Voltage-Max (Vsup)	3.6 V
Supply Voltage-Min (Vsup)	0.8 V
Supply Voltage-Nom (Vsup)	1.1 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Tin (Sn)
Terminal Form	GULL WING	NO LEAD
Terminal Pitch	0.65 mm	0.5 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	1.25 mm
Base Number Matches	2	3
	Logic » Gates	Logic » Gates