74AUP1G374GF
vs
74AUP1G374GM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SON
Package Description
1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Pin Count
6
6
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
S-PDSO-N6
R-PDSO-N6
JESD-609 Code
e3
e3
Length
1 mm
1.45 mm
Load Capacitance (CL)
30 pF
30 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
70000000 Hz
70000000 Hz
Max I(ol)
0.0017 A
0.0017 A
Moisture Sensitivity Level
1
1
Number of Bits
1
1
Number of Functions
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
VSON
Package Equivalence Code
SOLCC6,.04,14
SOLCC6,.04,20
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
21.6 ns
21.6 ns
Propagation Delay (tpd)
21.6 ns
21.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.35 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
1 mm
1 mm
fmax-Min
360 MHz
360 MHz
Base Number Matches
2
2
Compare 74AUP1G374GF with alternatives
Compare 74AUP1G374GM with alternatives