74AUP1G34GX
vs
74AUP1G34GM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SON
Package Description
HVSON,
VSON, SOLCC6,.04,20
Pin Count
5
6
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
NXP
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
S-PDSO-N5
R-PDSO-N6
JESD-609 Code
e3
e3
Length
0.8 mm
1.45 mm
Logic IC Type
BUFFER
BUFFER
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
5
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
VSON
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Propagation Delay (tpd)
20.8 ns
20.8 ns
Seated Height-Max
0.35 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.48 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
0.8 mm
1 mm
Base Number Matches
2
3
Load Capacitance (CL)
30 pF
Max I(ol)
0.0017 A
Package Equivalence Code
SOLCC6,.04,20
Packing Method
TR
Prop. Delay@Nom-Sup
20.8 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
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