74AUP1G34GX
vs
74AUP1G34GM
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SON
|
SON
|
| Package Description |
HVSON,
|
VSON, SOLCC6,.04,20
|
| Pin Count |
5
|
6
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Family |
AUP/ULP/V
|
AUP/ULP/V
|
| JESD-30 Code |
S-PDSO-N5
|
R-PDSO-N6
|
| JESD-609 Code |
e3
|
e3
|
| Length |
0.8 mm
|
1.45 mm
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
5
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
VSON
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Propagation Delay (tpd) |
20.8 ns
|
20.8 ns
|
| Seated Height-Max |
0.35 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.48 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
0.8 mm
|
1 mm
|
| Base Number Matches |
2
|
3
|
| Load Capacitance (CL) |
|
30 pF
|
| Max I(ol) |
|
0.0017 A
|
| Package Equivalence Code |
|
SOLCC6,.04,20
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
20.8 ns
|
| Qualification Status |
|
Not Qualified
|
| Schmitt Trigger |
|
NO
|
|
|
|
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