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74AUP1G18GW vs 74AUP1G18GM,132 feature comparison

74AUP1G18GW Nexperia

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74AUP1G18GM,132 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G6 R-PDSO-N6
JESD-609 Code e3 e3
Length 2 mm 1.45 mm
Logic IC Type MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER AND DEMUX/DECODER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Outputs 2 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 18.9 ns 18.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1 mm
Base Number Matches 2 2
Part Package Code SON
Package Description 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, SOT886, SON-6
Pin Count 6
Manufacturer Package Code SOT886
Factory Lead Time 4 Weeks
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code SOLCC6,.04,20
Packing Method TR
Prop. Delay@Nom-Sup 18.9 ns
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

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Compare 74AUP1G18GM,132 with alternatives