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74AUP1G18GW,125 vs 74AUP2G157GM,125 feature comparison

74AUP1G18GW,125 NXP Semiconductors

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74AUP2G157GM,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP QFN
Package Description PLASTIC, SOT363, SC-88, SMT-6 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8
Pin Count 6 8
Manufacturer Package Code SOT363 SOT902-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G6 S-PQCC-N8
JESD-609 Code e3 e4
Length 2 mm 1.6 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type MULTIPLEXER AND DEMUX/DECODER MULTIPLEXER
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 2
Number of Outputs 2 1
Number of Terminals 6 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VQCCN
Package Equivalence Code TSSOP6,.08 LCC8,.06SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 18.9 ns 22.8 ns
Propagation Delay (tpd) 18.9 ns 22.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.6 mm
Base Number Matches 2 2
Factory Lead Time 4 Weeks
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

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