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74AUP1G17GW,125 vs 935279995115 feature comparison

74AUP1G17GW,125 NXP Semiconductors

Buy Now Datasheet

935279995115 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 VSON,
Pin Count 5
Manufacturer Package Code SOT353-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 R-PDSO-N6
JESD-609 Code e3 e3
Length 2.05 mm 1.45 mm
Load Capacitance (CL) 30 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 20.1 ns
Propagation Delay (tpd) 20.1 ns 20.8 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1 mm
Base Number Matches 2 2
Logic » Gates
Logic » Gates

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