74AUP1G17GW,125 vs 74AUP1G07GF/S500,132 feature comparison

74AUP1G17GW,125 Nexperia

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74AUP1G07GF/S500,132 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 VSON,
Pin Count 5
Manufacturer Package Code SOT353-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 S-PDSO-N6
JESD-609 Code e3
Length 2.05 mm 1 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR, 7 INCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 20.1 ns 20.7 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.35 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1 mm
Base Number Matches 1 1
kg CO2e/kg 12.4
Average Weight (mg) 12.15
CO2e (mg) 150.66
Category CO2 Kg 12.4
Compliance Temperature Grade Automotive: -40C to +125C
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V6.10
Output Characteristics OPEN-DRAIN

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