74AUP1G17GN,132
vs
74AUP1G07GW-G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SON
|
TSSOT
|
| Package Description |
0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6
|
TSSOP,
|
| Pin Count |
6
|
5
|
| Manufacturer Package Code |
SOT1115
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
6 Weeks
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
AUP/ULP/V
|
AUP/ULP/V
|
| JESD-30 Code |
R-PDSO-N6
|
R-PDSO-G5
|
| JESD-609 Code |
e4
|
e3
|
| Length |
1 mm
|
2 mm
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
6
|
5
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SON
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR, 7 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
20.1 ns
|
20.7 ns
|
| Seated Height-Max |
0.35 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.3 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
0.9 mm
|
1.25 mm
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 74AUP1G17GN,132 with alternatives
Compare 74AUP1G07GW-G with alternatives