74AUP1G17GN,132 vs 74AUP1G17GW,125 feature comparison

74AUP1G17GN,132 Nexperia

Buy Now Datasheet

74AUP1G17GW,125 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code SON TSSOP
Package Description 0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
Pin Count 6 5
Manufacturer Package Code SOT1115 SOT353-1
Reach Compliance Code compliant compliant
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-G5
JESD-609 Code e4 e3
Length 1 mm 2.05 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 6 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SON TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 7 INCH TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 20.1 ns 20.1 ns
Seated Height-Max 0.35 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.3 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 0.9 mm 1.25 mm
Base Number Matches 1 1
HTS Code 8542.39.00.01
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code TSSOP5/6,.08
Prop. Delay@Nom-Sup 20.1 ns
Qualification Status Not Qualified
Schmitt Trigger YES

Compare 74AUP1G17GN,132 with alternatives

Compare 74AUP1G17GW,125 with alternatives