74AUP1G17GM,132 vs 74AUP1G34GW-Q100H feature comparison

74AUP1G17GM,132 Nexperia

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74AUP1G34GW-Q100H Nexperia

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NEXPERIA NEXPERIA
Part Package Code SON TSSOP
Package Description 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 TSSOP,
Pin Count 6 5
Manufacturer Package Code SOT886 SOT353-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer Nexperia Nexperia
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-G5
JESD-609 Code e4 e3
Length 1.45 mm 2.05 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 6 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 7 INCH TR, 7 INCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 20.1 ns 20.8 ns
Qualification Status Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD TIN
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.25 mm
Base Number Matches 1 1
Screening Level AEC-Q100

Compare 74AUP1G17GM,132 with alternatives

Compare 74AUP1G34GW-Q100H with alternatives