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74AUP1G17GF vs 74AUP1G17GF,132 feature comparison

74AUP1G17GF Nexperia

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74AUP1G17GF,132 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description VSON, 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code S-PDSO-N6 S-PDSO-N6
JESD-609 Code e3 e3
Length 1 mm 1 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSON
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 20.1 ns 20.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.35 mm 0.35 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1 mm
Base Number Matches 2 2
Part Package Code SON
Pin Count 6
Manufacturer Package Code SOT891
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code SOLCC6,.04,14
Packing Method TR
Prop. Delay@Nom-Sup 20.1 ns
Schmitt Trigger YES
Logic » Gates
Logic » Gates

Compare 74AUP1G17GF with alternatives

Compare 74AUP1G17GF,132 with alternatives