74AUP1G158GM vs 74AUP2G157GT-G feature comparison

74AUP1G158GM Nexperia

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74AUP2G157GT-G NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 S-PDSO-N8
JESD-609 Code e4 e4
Length 1.45 mm 1.95 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 6 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSON
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 21 ns 22.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1 mm 1 mm
Base Number Matches 2 1
Part Package Code SON
Package Description 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-883-1, SON-8
Pin Count 8
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code SOLCC8,.04,20
Packing Method TR
Prop. Delay@Nom-Sup 22.8 ns

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