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74AUP1G158GM vs 74AUP2G157DC,125 feature comparison

74AUP1G158GM Nexperia

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74AUP2G157DC,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-G8
JESD-609 Code e4 e4
Length 1.45 mm 2.3 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 6 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 21 ns 22.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 2 mm
Base Number Matches 2 2
Part Package Code SSOP
Package Description 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
Pin Count 8
Manufacturer Package Code SOT765-1
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code TSSOP8,.12,20
Packing Method TR
Prop. Delay@Nom-Sup 22.8 ns
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

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