74AUP1G14GF,132
vs
74HCT2G04GW
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SOT-363
Package Description
1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
TSSOP, TSSOP6,.08
Pin Count
6
6
Manufacturer Package Code
SOT891
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
AUP/ULP/V
HCT
JESD-30 Code
S-PDSO-N6
R-PDSO-G6
JESD-609 Code
e3
e3
Length
1 mm
2 mm
Load Capacitance (CL)
30 pF
50 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.0017 A
0.0045 A
Moisture Sensitivity Level
1
1
Number of Functions
1
2
Number of Inputs
1
1
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
TSSOP
Package Equivalence Code
SOLCC6,.04,14
TSSOP6,.08
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
20 ns
22 ns
Propagation Delay (tpd)
20 ns
29 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
6 V
Supply Voltage-Min (Vsup)
0.8 V
2 V
Supply Voltage-Nom (Vsup)
1.1 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.35 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1.25 mm
Base Number Matches
2
2
Pbfree Code
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