74AUP1G09GW
vs
74AUP1G09GF/S500
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOT
|
|
| Package Description |
TSSOP, TSSOP5/6,.08
|
VSON,
|
| Pin Count |
5
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AUP/ULP/V
|
AUP/ULP/V
|
| JESD-30 Code |
R-PDSO-G5
|
S-PDSO-N6
|
| JESD-609 Code |
e3
|
|
| Length |
2.05 mm
|
1 mm
|
| Load Capacitance (CL) |
30 pF
|
|
| Logic IC Type |
AND GATE
|
AND GATE
|
| Max I(ol) |
0.0017 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
5
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VSON
|
| Package Equivalence Code |
TSSOP5/6,.08
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
24 ns
|
|
| Propagation Delay (tpd) |
24 ns
|
24 ns
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
YES
|
|
| Seated Height-Max |
1.1 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.35 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.25 mm
|
1 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 74AUP1G09GF/S500 with alternatives