74AUP1G07GX,125
vs
74AUP1G17GN,132
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SON
Package Description
0.80 X 0.80 MM, 0.35 MM HEIGHT, PLASTIC, SOT-1226, X2SON-5
0.90 X 1 MM, 0.35 MM HEIGHT, SOT-1115, SON-6
Pin Count
5
6
Manufacturer Package Code
SOT1226
SOT1115
Reach Compliance Code
compliant
compliant
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
S-PDSO-N5
R-PDSO-N6
JESD-609 Code
e3
e3
Length
0.8 mm
1 mm
Load Capacitance (CL)
30 pF
30 pF
Logic IC Type
BUFFER
BUFFER
Max I(ol)
0.0017 A
0.0017 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
1
1
Number of Terminals
5
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SON
SON
Package Equivalence Code
LCC5(UNSPEC)
SOLCC6,.04,12
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
20.7 ns
20.1 ns
Propagation Delay (tpd)
20.7 ns
20.1 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
YES
Seated Height-Max
0.35 mm
0.35 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
TIN
TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.48 mm
0.3 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
0.8 mm
0.9 mm
Base Number Matches
2
2
Factory Lead Time
4 Weeks