74ALVTH32244ZKER
vs
SNJ54AS760FK
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
QLCC
|
| Package Description |
LFBGA-96
|
QCCN, LCC20,.35SQ
|
| Pin Count |
96
|
20
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES WITH 3.3V SUPPLY
|
|
| Control Type |
ENABLE LOW
|
ENABLE LOW
|
| Count Direction |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Family |
ALVT
|
AS
|
| JESD-30 Code |
R-PBGA-B96
|
S-CQCC-N20
|
| JESD-609 Code |
e1
|
e0
|
| Length |
13.5 mm
|
8.89 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.024 A
|
0.064 A
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
4
|
4
|
| Number of Functions |
8
|
8
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
96
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
OPEN-COLLECTOR
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
LFBGA
|
QCCN
|
| Package Equivalence Code |
BGA96,6X16,32
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
CHIP CARRIER
|
| Packing Method |
TR
|
TUBE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
5 mA
|
94 mA
|
| Prop. Delay@Nom-Sup |
2.5 ns
|
19.5 ns
|
| Propagation Delay (tpd) |
3.5 ns
|
19.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
2.03 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5.5 mm
|
8.89 mm
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-PRF-38535
|
|
|
|
Compare 74ALVTH32244ZKER with alternatives
Compare SNJ54AS760FK with alternatives