74ALVCH16373DL,112 vs IDT74ALVC16373PV feature comparison

74ALVCH16373DL,112 NXP Semiconductors

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IDT74ALVC16373PV Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code SSOP SSOP
Package Description PLASTIC, SSOP3-48 SSOP,
Pin Count 48 48
Manufacturer Package Code SOT370-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CAN ALSO OPERATES AT 3 TO 3.6 V RANGE
Family ALVC/VCX/A ALVC/VCX/A
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e4 e0
Length 15.875 mm 15.875 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1 1
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 48 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP48,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 3.3 ns
Propagation Delay (tpd) 3.9 ns 5.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.794 mm
Supply Voltage-Max (Vsup) 2.7 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.7 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.5 mm
Base Number Matches 1 1
Pbfree Code No

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