74ALVCF162835APA8
vs
935267300112
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
NXP SEMICONDUCTORS
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP-56
TSSOP,
Pin Count
56
56
Manufacturer Package Code
PA56
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ALVC/VCX/A
ALVC/VCX/A
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
JESD-609 Code
e0
e4
Length
14 mm
14 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
18
1
Number of Functions
1
18
Number of Ports
2
2
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE WITH SERIES RESISTOR
3-STATE WITH SERIES RESISTOR
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP56,.3,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
240
NOT SPECIFIED
Propagation Delay (tpd)
5.6 ns
6.3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
1.2 V
Supply Voltage-Nom (Vsup)
3.3 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
6.1 mm
6.1 mm
Base Number Matches
1
2
Compare 74ALVCF162835APA8 with alternatives
Compare 935267300112 with alternatives