74ALVC164245DGG/T3
vs
SN74ALVC164245KR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
TSSOP
BGA
Package Description
TSSOP,
VFBGA-56
Pin Count
48
56
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
PORT A IS OPERATED AT VOLTAGE 1.5-3.6V
ALSO REQUIRES 3.3V TO 5.5V SUPPLY FOR PORT B
Family
ALVC/VCX/A
ALVC/VCX/A
JESD-30 Code
R-PDSO-G48
R-PBGA-B56
JESD-609 Code
e4
e0
Length
12.5 mm
7 mm
Logic IC Type
BUS TRANSCEIVER
BUS TRANSCEIVER
Moisture Sensitivity Level
1
1
Number of Bits
8
8
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
48
56
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
240
Propagation Delay (tpd)
9.5 ns
7.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.5 V
2.5 V
Supply Voltage-Nom (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
6.1 mm
4.5 mm
Base Number Matches
1
1
Control Type
COMMON CONTROL
Count Direction
BIDIRECTIONAL
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
BGA56,6X10,25
Packing Method
TR
Prop. Delay@Nom-Sup
5.8 ns
Compare 74ALVC164245DGG/T3 with alternatives
Compare SN74ALVC164245KR with alternatives