74ALVC16245DGG,512 vs IDT74ALVC16245PA8 feature comparison

74ALVC16245DGG,512 NXP Semiconductors

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IDT74ALVC16245PA8 Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP48,.3,20 TSSOP, TSSOP48,.3,20
Pin Count 48 48
Manufacturer Package Code SOT362-1
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Additional Feature WITH DIRECTION CONTROL WITH DIRECTION CONTROL
Control Type COMMON CONTROL COMMON CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family ALVC/VCX/A ALVC/VCX/A
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e4 e0
Length 12.5 mm 12.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 48 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP48,.3,20 TSSOP48,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 3 ns 3 ns
Propagation Delay (tpd) 3.7 ns 3.7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 2.5 V
Supply Voltage-Nom (Vsup) 3.3 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn85Pb15)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 6.1 mm 6.1 mm
Base Number Matches 2 1
Packing Method TR

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