74ALVC02BQ,115
vs
DM5404MW8
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
|
DIE,
|
| Pin Count |
14
|
|
| Manufacturer Package Code |
SOT762-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
ALVC/VCX/A
|
TTL/H/L
|
| JESD-30 Code |
R-PQCC-N14
|
X-XUUC-N14
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
|
| Logic IC Type |
NOR GATE
|
INVERTER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
6
|
| Number of Inputs |
2
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
DIE
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
UNCASED CHIP
|
| Packing Method |
TR, 7 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
4.7 ns
|
15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2.5 mm
|
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
DIE OR CHIP
|
|
|
|
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