74ALS163BDB-T vs DM74ALS163BM feature comparison

74ALS163BDB-T NXP Semiconductors

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DM74ALS163BM Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code SSOP2 SOIC
Package Description SSOP, SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature TCO OUTPUT TCO OUTPUT
Count Direction UP UP
Family ALS ALS
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 6.2 mm 9.9 mm
Load Capacitance (CL) 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Power Supply Current-Max (ICC) 21 mA
Propagation Delay (tpd) 16 ns 20 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 2 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 3.9 mm
fmax-Min 100 MHz 40 MHz
Base Number Matches 1 4
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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