74ALS11AN
vs
MC74ACT11DR2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ON SEMICONDUCTOR
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
0.300 INCH, PLASTIC, DIP-14
|
SOP, SOP14,.25
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ALS
|
ACT
|
| JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
| Length |
19.025 mm
|
8.65 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
AND GATE
|
AND GATE
|
| Number of Functions |
3
|
3
|
| Number of Inputs |
3
|
3
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
3 mA
|
|
| Propagation Delay (tpd) |
11 ns
|
10.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e0
|
| Max I(ol) |
|
0.024 A
|
| Package Equivalence Code |
|
SOP14,.25
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Prop. Delay@Nom-Sup |
|
10.5 ns
|
| Schmitt Trigger |
|
NO
|
| Terminal Finish |
|
Tin/Lead (Sn80Pb20)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 74ALS11AN with alternatives
Compare MC74ACT11DR2 with alternatives