74AHCT3G14DC,125 vs 74HCT2G02DC feature comparison

74AHCT3G14DC,125 NXP Semiconductors

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74HCT2G02DC Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code SSOP
Package Description 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 TSSOP, TSSOP8,.12,20
Pin Count 8
Manufacturer Package Code SOT765-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHCT/VHCT/VT
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e4
Length 2.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER NOR GATE
Max I(ol) 0.008 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 3
Number of Inputs 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP TSSOP
Package Equivalence Code TSSOP8,.12,20 TSSOP8,.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 11 ns 29 ns
Propagation Delay (tpd) 11 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 2 mm
Base Number Matches 2 3

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