74AHCT3G14DC,125
vs
74HCT2G02DC
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
SSOP
Package Description
2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8
TSSOP, TSSOP8,.12,20
Pin Count
8
Manufacturer Package Code
SOT765-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AHCT/VHCT/VT
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
Length
2.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
INVERTER
NOR GATE
Max I(ol)
0.008 A
0.004 A
Moisture Sensitivity Level
1
Number of Functions
3
Number of Inputs
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
TSSOP
Package Equivalence Code
TSSOP8,.12,20
TSSOP8,.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
11 ns
29 ns
Propagation Delay (tpd)
11 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2 mm
Base Number Matches
2
3
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