74AHCT32BQ
vs
74LVC132ABQ,115
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
QCCN, LCC14,.1X.12,20
HVQCCN, LCC14,.1X.12,20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PQCC-N14
R-PQCC-N14
JESD-609 Code
e4
e4
Load Capacitance (CL)
50 pF
Logic IC Type
OR GATE
NAND GATE
Max I(ol)
0.008 A
0.024 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCN
HVQCCN
Package Equivalence Code
LCC14,.1X.12,20
LCC14,.1X.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method
TR
TR
Prop. Delay@Nom-Sup
10 ns
8 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
YES
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Base Number Matches
3
2
Part Package Code
QFN
Pin Count
14
Manufacturer Package Code
SOT762-1
Family
LVC/LCX/Z
Length
3 mm
Moisture Sensitivity Level
1
Number of Functions
4
Number of Inputs
2
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
16 ns
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
1.2 V
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
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