74AHCT32BQ vs 74LVC132ABQ,115 feature comparison

74AHCT32BQ Philips Semiconductors

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74LVC132ABQ,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description QCCN, LCC14,.1X.12,20 HVQCCN, LCC14,.1X.12,20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PQCC-N14 R-PQCC-N14
JESD-609 Code e4 e4
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE NAND GATE
Max I(ol) 0.008 A 0.024 A
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCN HVQCCN
Package Equivalence Code LCC14,.1X.12,20 LCC14,.1X.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR TR
Prop. Delay@Nom-Sup 10 ns 8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Base Number Matches 3 2
Part Package Code QFN
Pin Count 14
Manufacturer Package Code SOT762-1
Family LVC/LCX/Z
Length 3 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 16 ns
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 1.2 V
Time@Peak Reflow Temperature-Max (s) 30
Width 2.5 mm

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