74AHCT1G00DCKRE4 vs 74HCT1G00GW,165 feature comparison

74AHCT1G00DCKRE4 Texas Instruments

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74HCT1G00GW,165 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description TSSOP, TSSOP5/6,.08 TSSOP,
Pin Count 5 5
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1996-05-01
Family AHCT/VHCT/VT HCT
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e4 e3
Length 2 mm 2 mm
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.008 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 9 ns
Propagation Delay (tpd) 9 ns 27 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 1 2
Manufacturer Package Code SOT353-1

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