Findchips: Compare 74AHCT08BQ,115 vs HCS10HMSR

74AHCT08BQ,115 vs HCS10HMSR feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	INTERSIL CORP
Part Package Code	QFN	DIE
Package Description	HVQCCN, LCC14,.1X.12,20	DIE,
Pin Count	14	14
Manufacturer Package Code	SOT762-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	AHCT/VHCT/VT	HC/UH
JESD-30 Code	R-PQCC-N14	R-XUUC-N14
JESD-609 Code	e4
Length	3 mm
Load Capacitance (CL)	50 pF
Logic IC Type	AND GATE	NAND GATE
Max I(ol)	0.008 A
Moisture Sensitivity Level	1
Number of Functions	4	3
Number of Inputs	2	3
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-55 °C
Package Body Material	PLASTIC/EPOXY	UNSPECIFIED
Package Code	HVQCCN	DIE
Package Equivalence Code	LCC14,.1X.12,20	DIE OR CHIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	UNCASED CHIP
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	9 ns
Propagation Delay (tpd)	10 ns	22 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	MILITARY
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm
Terminal Position	QUAD	UPPER
Time@Peak Reflow Temperature-Max (s)	30
Width	2.5 mm
Base Number Matches	2	1
Total Dose		200k Rad(Si) V
	Logic » Gates	Logic » Gates