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74AHC574PW,112 vs 74AHC574PWDH feature comparison

74AHC574PW,112 NXP Semiconductors

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74AHC574PWDH NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP2
Package Description 4.4 MM, PLASTIC, MO-153, SOT360, TSSOP-20 TSSOP,
Pin Count 20
Manufacturer Package Code SOT360-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature BROADSIDE VERSION OF 374 BROADSIDE VERSION OF 374
Family AHC/VHC/H/U/V AHC
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4
Length 6.5 mm 6.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max Frequency@Nom-Sup 75000000 Hz
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP20,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 13.5 ns
Propagation Delay (tpd) 21 ns 21 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE
Width 4.4 mm 4.4 mm
Base Number Matches 2 1
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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