74AHC3G14GD
vs
74AHC3GU04DP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SON
SOIC
Package Description
3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, SON-8
3 MM WIDTH, PLASTIC, SOT505-2, TSSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AHC/VHC/H/U/V
AHC/VHC/H/U/V
JESD-30 Code
R-PDSO-N8
S-PDSO-G8
JESD-609 Code
e4
e4
Length
3 mm
3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.008 A
0.008 A
Moisture Sensitivity Level
1
1
Number of Functions
3
3
Number of Inputs
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
TSSOP
Package Equivalence Code
SOLCC8,.11,20
TSSOP8,.16
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
13.5 ns
9 ns
Propagation Delay (tpd)
20.5 ns
13.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
NO
Seated Height-Max
0.5 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
2 mm
3 mm
Base Number Matches
2
3
Compare 74AHC3G14GD with alternatives
Compare 74AHC3GU04DP with alternatives