74AHC273D,118 vs TC74VHC273FW(ELP) feature comparison

74AHC273D,118 NXP Semiconductors

Buy Now Datasheet

TC74VHC273FW(ELP) Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOP SOIC
Package Description 7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20 SOP, SOP20,.4
Pin Count 20 20
Manufacturer Package Code SOT163-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family AHC AHC/VHC
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e0
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 70000000 Hz 70000000 Hz
Max I(ol) 0.008 A 0.008 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4 SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 14 ns
Propagation Delay (tpd) 21.5 ns 12.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.7 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.5 mm 7.5 mm
fmax-Min 100 MHz 70 MHz
Base Number Matches 1 1
Pbfree Code No

Compare 74AHC273D,118 with alternatives

Compare TC74VHC273FW(ELP) with alternatives