74AHC1G09GV,125
vs
74AHC1G09GV-Q100
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSOP
|
SC-74A
|
Package Description |
PLASTIC, SC-74A, SOT-753, 5 PIN
|
SSOP,
|
Pin Count |
5
|
5
|
Manufacturer Package Code |
SOT753
|
SOT753
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AHC/VHC/H/U/V
|
AHC/VHC/H/U/V
|
JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
e3
|
Length |
2.9 mm
|
2.9 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
AND GATE
|
AND GATE
|
Max I(ol) |
0.008 A
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SSOP
|
Package Equivalence Code |
TSOP5/6,.11,37
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Prop. Delay@Nom-Sup |
8.5 ns
|
|
Propagation Delay (tpd) |
12.5 ns
|
12.5 ns
|
Qualification Status |
Not Qualified
|
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
1.1 mm
|
1.9 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
1.5 mm
|
1.5 mm
|
Base Number Matches |
2
|
2
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare 74AHC1G09GV,125 with alternatives