74AHC1G08GW,165 vs SN74AHC1G08QDCKRQ1 feature comparison

74AHC1G08GW,165 NXP Semiconductors

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SN74AHC1G08QDCKRQ1 Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP SOIC
Package Description TSSOP, GREEN, PLASTIC, SC-70, 5 PIN
Pin Count 5 5
Manufacturer Package Code SOT353-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AHC/VHC/H/U/V
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e4
Length 2.05 mm 2 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 16 ns 16.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Pbfree Code Yes
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Power Supply Current-Max (ICC) 0.02 mA
Prop. Delay@Nom-Sup 16.5 ns
Schmitt Trigger YES
Screening Level AEC-Q100

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Compare SN74AHC1G08QDCKRQ1 with alternatives