74AHC1G02GV,125
vs
74HC1G02GV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
TSOP
Package Description
PLASTIC, SOT753, SC-74A, 5 PIN
TSOP, TSOP5/6,.11,37
Pin Count
5
Manufacturer Package Code
SOT753
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
AHC
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
e3
Length
2.9 mm
Logic IC Type
NOR GATE
NOR GATE
Max I(ol)
0.008 A
0.002 A
Moisture Sensitivity Level
1
1
Number of Functions
1
Number of Inputs
2
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSOP
Package Equivalence Code
TSOP5/6,.11,37
TSOP5/6,.11,37
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
9.5 ns
27 ns
Propagation Delay (tpd)
14.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
0.95 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.5 mm
Base Number Matches
2
3
Load Capacitance (CL)
50 pF
Packing Method
TR
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