74AHC157BQ
vs
SN74AHC257DBLE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
QFN
SOIC
Package Description
HVQCCN, LCC16,.1X.14,20
SSOP, SSOP16,.3
Pin Count
16
16
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AHC/VHC/H/U/V
AHC
JESD-30 Code
R-PQCC-N16
R-PDSO-G16
JESD-609 Code
e4
Length
3.5 mm
6.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.008 A
0.008 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
SSOP
Package Equivalence Code
LCC16,.1X.14,20
SSOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
11 ns
Propagation Delay (tpd)
21.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
2.5 mm
5.3 mm
Base Number Matches
2
1
Output Characteristics
3-STATE
Packing Method
TR
Compare 74AHC157BQ with alternatives
Compare SN74AHC257DBLE with alternatives