74AHC157BQ vs MC74AC157D feature comparison

74AHC157BQ Nexperia

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MC74AC157D onsemi

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Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA ON SEMICONDUCTOR
Package Description HVQCCN, LCC16,.1X.14,20 SOP, SOP16,.25
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1999-09-24
Family AHC/VHC/H/U/V AC
JESD-30 Code R-PQCC-N16 R-PDSO-G16
JESD-609 Code e4 e0
Length 3.5 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.008 A 0.012 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Equivalence Code LCC16,.1X.14,20 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 235
Power Supply Current-Max (ICC) 0.08 mA
Prop. Delay@Nom-Sup 10.5 ns 13 ns
Propagation Delay (tpd) 16.5 ns 9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 2.5 mm 3.9 mm
Base Number Matches 4 8
Part Package Code SOIC
Pin Count 16
Additional Feature TTL COMPATIBLE INPUTS
Packing Method RAIL

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