74AHC132D-Q100J
vs
74LV132D-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
SOP,
Pin Count
14
14
Manufacturer Package Code
SOT108-1
Reach Compliance Code
compliant
unknown
Family
AHC/VHC/H/U/V
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.008 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Prop. Delay@Nom-Sup
12.5 ns
Propagation Delay (tpd)
19.5 ns
43 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
YES
Screening Level
AEC-Q100
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
2
3
HTS Code
8542.39.00.01
JESD-609 Code
e4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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