74AHC125D,118
vs
74AHC125D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
SOIC
Package Description
3.90 MM, PLASTIC, MS-012, SOT-108-1, SOP-14
Pin Count
14
Manufacturer Package Code
SOT108-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
ENABLE LOW
Family
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e4
Length
8.65 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.008 A
0.008 A
Moisture Sensitivity Level
1
Number of Bits
1
4
Number of Functions
4
1
Number of Ports
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
8.5 ns
8.5 ns
Propagation Delay (tpd)
14.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
2
3
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