74AHC08D,112
vs
74VHC08MTR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
STMICROELECTRONICS
Part Package Code
SOIC
SOIC
Package Description
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
SOP, SOP14,.25
Pin Count
14
14
Manufacturer Package Code
SOT108-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
AHC/VHC/H/U/V
AHC/VHC/H/U/V
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e4
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.008 A
0.008 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TUBE
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
9 ns
9 ns
Propagation Delay (tpd)
15.5 ns
14 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
40
Width
3.9 mm
3.9 mm
Base Number Matches
1
1
Pbfree Code
Compare 74AHC08D,112 with alternatives
74AHC08D,112 vs MC74VHC08D
74AHC08D,112 vs SN74AHC08DG4
74AHC08D,112 vs 74VHC08M
74AHC08D,112 vs SN74AHC08D
74AHC08D,112 vs MC74VHC08DR2
74AHC08D,112 vs SN74AHC08DRE4
74AHC08D,112 vs 935262678112
74AHC08D,112 vs 74AHC08D-T
74AHC08D,112 vs 74AHC08D,118
Compare 74VHC08MTR with alternatives