74AHC02PW,112
vs
MC74VHC02DT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
TSSOP, TSSOP14,.25
Pin Count
14
Manufacturer Package Code
SOT402-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
AHC/VHC/H/U/V
AHC/VHC
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e0
Length
5 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NOR GATE
NOR GATE
Max I(ol)
0.008 A
0.008 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP14,.25
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
9.5 ns
8.5 ns
Propagation Delay (tpd)
14.5 ns
13 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.1 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
4.4 mm
Base Number Matches
2
5
Compare 74AHC02PW,112 with alternatives
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74AHC02PW,112 vs 74VHC02MTC
74AHC02PW,112 vs TC74VHC02FT(EL)
74AHC02PW,112 vs 74AHC02PW,118
74AHC02PW,112 vs SN74LV02APWRG4
74AHC02PW,112 vs MC74VHC02DTR2
74AHC02PW,112 vs MC74LVX02DT
74AHC02PW,112 vs HD74LV02T
74AHC02PW,112 vs SN74AHC02PWG4