74AHC00BQ
vs
HCS10HMSR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
INTERSIL CORP
Part Package Code
QFN
DIE
Package Description
HVQCCN, LCC14,.1X.12,20
DIE,
Pin Count
14
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AHC/VHC/H/U/V
HC/UH
JESD-30 Code
R-PQCC-N14
R-XUUC-N14
JESD-609 Code
e4
Length
3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.008 A
Moisture Sensitivity Level
1
Number of Functions
4
3
Number of Inputs
2
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
HVQCCN
DIE
Package Equivalence Code
LCC14,.1X.12,20
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
UNCASED CHIP
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
9.5 ns
Propagation Delay (tpd)
14.5 ns
22 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
QUAD
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
Base Number Matches
2
1
Total Dose
200k Rad(Si) V
Compare 74AHC00BQ with alternatives
Compare HCS10HMSR with alternatives