74AHC00BQ,115 vs 74AHC00BQ,115 feature comparison

74AHC00BQ,115 NXP Semiconductors

Buy Now Datasheet

74AHC00BQ,115 Nexperia

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code QFN QFN
Package Description 2.50 X 3MM, 0.85 MM, PLASTIC, MO-241, SOT762-1, DHVQFN-14 2.50 X 3MM, 0.85 MM, PLASTIC, MO-241, SOT762-1, DHVQFN-14
Pin Count 14 14
Manufacturer Package Code SOT762-1 SOT762-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC/H/U/V AHC/VHC/H/U/V
JESD-30 Code R-PQCC-N14 R-PQCC-N14
JESD-609 Code e4 e4
Length 3 mm 3 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.008 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC14,.1X.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR TR, 7 INCH
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 9.5 ns
Propagation Delay (tpd) 14.5 ns 14.5 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2.5 mm 2.5 mm
Base Number Matches 1 1
Factory Lead Time 8 Weeks
Samacsys Manufacturer Nexperia

Compare 74AHC00BQ,115 with alternatives

Compare 74AHC00BQ,115 with alternatives