74ACT818SJ
vs
5962-9160901MLA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
QP SEMICONDUCTOR INC
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
SCANNABLE
SCANNABLE
Family
ACT
ACT
JESD-30 Code
R-PDSO-G24
R-GDIP-T24
Length
15.24 mm
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
9.5 ns
14 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.25 mm
5.715 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
5.3 mm
7.62 mm
Base Number Matches
1
4
JESD-609 Code
e0
Screening Level
MIL-STD-883
Terminal Finish
TIN LEAD
Compare 74ACT818SJ with alternatives
Compare 5962-9160901MLA with alternatives