74ACT11257N
vs
54HST157FC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
GEC PLESSEY SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, PLASTIC, DIP-20
|
,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
CENTER VCC/GND PINS
|
|
| Family |
ACT
|
HST/T
|
| JESD-30 Code |
R-PDIP-T20
|
R-CDFP-F16
|
| Length |
24.325 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.024 A
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Equivalence Code |
DIP20,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Packing Method |
TUBE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
8.7 ns
|
|
| Propagation Delay (tpd) |
9.4 ns
|
25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
5
|
2
|
|
|
|
Compare 74ACT11257N with alternatives
Compare 54HST157FC with alternatives