74ACT11244DBRG4
vs
74ACT11244N
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
PHILIPS SEMICONDUCTORS
Part Package Code
SSOP
Package Description
SSOP, SSOP24,.3
DIP, DIP24,.3
Pin Count
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ACT
JESD-30 Code
R-PDSO-G24
R-PDIP-T24
JESD-609 Code
e4
e0
Length
8.2 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Ports
2
2
Number of Terminals
24
24
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
DIP
Package Equivalence Code
SSOP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
9.9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
5.3 mm
Base Number Matches
1
2
Max I(ol)
0.024 A
Prop. Delay@Nom-Sup
12.5 ns
Compare 74ACT11244DBRG4 with alternatives