74AC32B
vs
MC74AC32N
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
AC
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
Logic IC Type
OR GATE
OR GATE
Max I(ol)
0.024 A
0.012 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supply Current-Max (ICC)
0.04 mA
Propagation Delay (tpd)
12 ns
7.5 ns
Seated Height-Max
5.1 mm
4.69 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
7.62 mm
Base Number Matches
2
5
Part Package Code
DIP
Pin Count
14
JESD-609 Code
e0
Length
18.86 mm
Load Capacitance (CL)
50 pF
Prop. Delay@Nom-Sup
10 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
Compare 74AC32B with alternatives
Compare MC74AC32N with alternatives