74AC257PC
vs
TC74HC253AFN(TP1)
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Lifetime Buy
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
TOSHIBA CORP
Part Package Code
DIP
SOIC
Package Description
0.300 INCH, PLASTIC, MS-001, DIP-16
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
AC
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e3
Length
19.305 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.024 A
Number of Functions
4
2
Number of Inputs
2
4
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power Supply Current-Max (ICC)
0.04 mA
Prop. Delay@Nom-Sup
9 ns
Propagation Delay (tpd)
11.5 ns
38 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
3.9 mm
Base Number Matches
4
1
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 74AC257PC with alternatives
Compare TC74HC253AFN(TP1) with alternatives