74AC11074N
vs
74AC11074PWLE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Package Description
DIP-14
TSSOP, TSSOP14,.25
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP14,.3
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
4
1
Pbfree Code
Part Package Code
TSSOP
Pin Count
14
Family
AC
Length
5 mm
Max I(ol)
0.024 A
Packing Method
TR
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
11.3 ns
Seated Height-Max
1.2 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
4.4 mm
fmax-Min
125 MHz
Compare 74AC11074PWLE with alternatives