74AC11074N vs 74AC11074NSR feature comparison

74AC11074N Philips Semiconductors

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74AC11074NSR Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS TEXAS INSTRUMENTS INC
Package Description DIP-14 SOP, SOP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 4 1
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Family AC
Length 10.2 mm
Max I(ol) 0.024 A
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 11.3 ns
Seated Height-Max 2 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm
fmax-Min 125 MHz

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