74AC08PW-T vs MC74AC08DT feature comparison

74AC08PW-T NXP Semiconductors

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MC74AC08DT onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Package Description TSSOP, TSSOP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AC AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 6 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 4
Pbfree Code Yes
Rohs Code Yes
Part Package Code TSSOP
Pin Count 14
Factory Lead Time 4 Weeks
JESD-609 Code e4
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 10 ns
Schmitt Trigger NO
Terminal Finish NICKEL PALLADIUM GOLD

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Compare MC74AC08DT with alternatives